Planarization process using artificial gravity

Details Planarization process using artificial gravity Planarization process using artificial gravity

1996-08-22

1998-02-03

Bowers, Jr., Charles L.

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

438697, H01L 214763

Patent

active

057144176

ABSTRACT:
The time needed to planarize the surface of an integrated circuit is reduced by causing the planarization liquid to settle in the presence of artificial gravity that supplements natural gravity. A number of different ways to achieve artificial gravity are described. These include centrifuging, magnetic repulsion, vertical pulling by a motor, and providing a pressure differential between the top and bottom sides of the wafer holder.

REFERENCES:
patent: 4973544 (1990-11-01), Slayman et al.
patent: 5264246 (1993-11-01), Ikeno
patent: 5348615 (1994-09-01), Gupta
patent: 5449644 (1995-09-01), Hong et al.

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