Planarization method, workpiece measuring method, and surface pl

Details Planarization method, workpiece measuring method, and surface pl Planarization method, workpiece measuring method, and surface pl

1998-02-20

2000-05-23

Breneman, Bruce

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

216 88, 438 8, 438692, B24B 500

Patent

active

060662301

ABSTRACT:
A [work] workpiece processing apparatus and a [work] workpiece measuring method are provided in which a [work] workpiece can be processed or planarized without decreasing a processing rate and/or an operating rate of the apparatus. The apparatus can be reduced in size, and can measure the state of planarization of the [work] workpiece at a high degree of accuracy. The apparatus includes a rotatable surface plate, and a carrier 6 for swinging or oscillating a [work] workpiece 200 in a radial direction of the surface plate 1 while pressing the [work] workpiece 200 against the surface plate 1. The surface plate 1 is divided into an inner surface plate member 11, an intermediate surface plate member 12, and an outer surface plate member 13 which are all disposed in a concentric relation and rotatable independently of each other. The intermediate surface plate member 12 is disposed between the inner and outer surface plate members 11 and 13.

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