Planarization for integrated circuits

Details Planarization for integrated circuits Planarization for integrated circuits

2007-01-23

2007-01-23

Baumeister, B. William (Department: 2891)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S778000, C438S780000, C438S784000, C257SE21259

Reexamination Certificate

active

10923435

ABSTRACT:
A method of planarizing a layer of an integrated circuit. In one embodiment, a liquid film is applied over the layer, using extrusion coating techniques. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques.

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