Planarization for integrated circuits

Details Planarization for integrated circuits Planarization for integrated circuits

2006-06-13

2006-06-13

Elms, Richard (Department: 2824)

Semiconductor device manufacturing: process

Coating of substrate containing semiconductor region or of...

Insulative material deposited upon semiconductive substrate

C438S778000, C438S760000

Reexamination Certificate

active

07060633

ABSTRACT:
A method of planarizing a layer of an integrated circuit. In one embodiment, a liquid film is applied over the layer, using extrusion coating techniques. In another embodiment, the layer itself may be applied as a liquid film, using extrusion techniques.

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Jaeger, R.C., “Introduction to Microelectronic Fabrication,” Modular Series on Solid State Devices, vol. V, 1988, p. 21, Addison-Wesley Publishing Company, Inc.
DeForest, W.S., “Photoresist Materials and Processes,” 1975, pp. 2, 3, 23 & 48, McGraw-Hill Book Company.
U.S. Appl. No. 10/113,008, filed Mar. 29, 2002, Brenner.

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