Planar multi-level metal process with built-in etch stop

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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29580, 156644, 156646, 156653, 156655, 1566611, 156668, 204192E, 357 67, 357 71, 427 89, 427 90, 430313, 430317, B44C 122, C03C 1500, C03C 2506, C23F 102

Patent

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043671195

ABSTRACT:
Use of a dual composite mask for a lift-off multi-layered structure process in which a base component layer acts as an etch stop for reactive ion etching of overlying layers.

REFERENCES:
patent: 3479237 (1969-11-01), Bergh et al.
patent: 3985597 (1976-10-01), Zielinski
patent: 4028155 (1977-06-01), Jacob
patent: 4070501 (1978-01-01), Corbin et al.
patent: 4090006 (1978-05-01), Havas et al.
patent: 4155802 (1979-05-01), Yonezawa et al.
patent: 4184909 (1980-01-01), Chang et al.

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