Planar metal interconnection system and process

Details Planar metal interconnection system and process Planar metal interconnection system and process

1980-07-03

1981-12-22

Kimlin, Edward C.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

156643, 156646, 156656, 1566591, 1566611, 204192E, 430316, 430317, 430318, 430323, 430324, G03C 500

Patent

active

043071791

ABSTRACT:
A process for forming a layer of a metallurgy interconnection system on a substrate. The process involves forming a first electrically insulative layer of an organic polymerized resin material on the substrate, forming a second thin layer on the first layer which is resistant to dry etching conditions which are effective to etch the first layer, depositing a photoresist layer on the second layer, exposing the photoresist to form an inverse pattern of a desired metallurgy pattern and developing the photoresist, reactive ion etching the resultant exposed areas of the first and second layers, depositing a blanket continuous conductive metal layer over the hills and valleys of the pattern resulting from reactive ion etching, applying a planarizing photoresist layer, etching the photoresist to expose high spots of the metal layer, and etching the metal high spots to a depth sufficient to expose the surface of the second layer.

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J. J. Colacino and T. A. Bartush, "Removal of Quartz Spikes _Over Metal Lands," IBM TDB, vol. 20, No. 4, Sep. 1977, p. 1381.

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