Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Patent
1989-03-13
1990-09-04
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
430317, 430318, 437190, 437192, 156652, 156643, G03C 500
Patent
active
049544233
ABSTRACT:
A method of interconnecting metal layers in integrated circuits separated by an intermediate dielectric layer by forming first and pillar layers of metal, etching the pillar layer to form a pillar of electrically conducting material and etching the first level to form the first level lead. A layer of dielectric is applied to cover the pillar and first level lead. A layer of photoresist is deposited over the dielectric with a spin on technique to form a planar surface. The dielectric and photoresist are etched back with an equal etch rate until a top portion of the pillar is exposed. A second level lead is formed atop the pillar and planar top surface of the dielectric.
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Garcia, Jr. Evaristo
McMann Ronald E.
Thompson Stephen W.
Welch Michael T.
Barndt B. Peter
Comfort James T.
Dees Jos,e G.
Sharp Melvin
Texas Instruments Incorporated
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