Inductor devices – With supporting and/or spacing means between coil and core – Preformed insulation between coil and core
Reexamination Certificate
2011-06-28
2011-06-28
Mai, Anh T (Department: 2832)
Inductor devices
With supporting and/or spacing means between coil and core
Preformed insulation between coil and core
C336S083000, C336S182000, C336S192000, C336S208000, C336S212000, C336S220000, C336S221000, C336S222000
Reexamination Certificate
active
07969272
ABSTRACT:
Generally, a low-profile planar core structure for use in magnetic components and related processes are presented herein. More specifically, the planar core structure provides a relatively large winding area that reduces heat dissipation, reduces leakage inductance, and allows for a low-profile design. The planar core structure has a center core that is elongated along a horizontal axis. Furthermore, conductors may enter and exit the planar core structure without increasing its height.
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Brinlee Antony
Silva Arturo
Flextronics AP LLC
Larsen Per H.
Lian Mangtin
Mai Anh T
Marsh Fischmann and Breyfogle LLP
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