Placing a MEMS part on an application platform using a guide...

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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C438S053000, C438S455000, C257S415000, C257S416000, C257S417000, C257S418000, C257S419000, C257S420000, C257SE29324, C029S842000, C029S874000, C428S307300

Reexamination Certificate

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07811849

ABSTRACT:
A method for fabricating a micro-electro-mechanical system (MEMS) device. The method comprises placing a guiding mask on an application platform, the guiding mask including an opening that defines the position of a MEMS part to be placed on the application platform. The method further comprises placing the MEMS part into the opening of the guiding mask on the application platform, and removing the guiding mask from the application platform after the MEMS part is bonded to the application platform.

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