Placement of absorbing material in a semiconductor device

Details Placement of absorbing material in a semiconductor device Placement of absorbing material in a semiconductor device

2006-05-16

2006-05-16

Clark, Jasmine (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S682000, C257S704000, C257S710000

Reexamination Certificate

active

07045885

ABSTRACT:
A semiconductor device includes a hermetically sealed housing having a top member and a bottom member. The bottom member includes a recess. A semiconductor die is enclosed within the housing. Absorbing material is positioned in the recess under the semiconductor die. A porous film is positioned between the semiconductor die and the absorbing material.

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