Pin lift chuck assembly for warped substrates

Details Pin lift chuck assembly for warped substrates Pin lift chuck assembly for warped substrates

2007-11-06

2007-11-06

Sherry, Michael (Department: 2836)

Electricity: electrical systems and devices

Electric charge generating or conducting means

Use of forces of electric charge or field

Reexamination Certificate

active

10962737

ABSTRACT:
A vacuum chuck apparatus may include chuck plate having a substantially flat chucking surface, one or more lift pins, and a lifting mechanism. The lift pins are configured to clamp a substrate at three or more locations. The lifting mechanism lifts the heads of the pins above the level of the chucking surface subsequently lowers the pins to pull the substrate to substantially conform to the chucking surface. A warped substrate may be secured to the chuck surface by raising the lift pins above the surface of chuck, securing a backside of the substrate with the lift pins at three or more locations, and lowering the lift pins to draw the substrate against the surface of the chuck so that the substrate substantially conforms to the surface of the chuck.

REFERENCES:
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patent: 5609377 (1997-03-01), Tanaka
patent: 6062133 (2000-05-01), Blalock
patent: 6517130 (2003-02-01), Donoso et al.
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patent: 6866746 (2005-03-01), Lei et al.
patent: 7040971 (2006-05-01), Zuniga et al.

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