Pin for brazing to a substrate and improved package resulting th

Details Pin for brazing to a substrate and improved package resulting th Pin for brazing to a substrate and improved package resulting th

1980-06-30

1982-11-23

Shedd, Wayne L.

Joints and connections

Molded joint

Fusion bond, e.g., weld, etc.

403270, 403406, 228168, B25G 334, F16B 1100, F16B 1204, F16L 1300

Patent

active

043602894

ABSTRACT:
A pin designed to be attached to a solid state module for making connection between the module and other parts of a metallurgical system. The end of the pin that is to be brazed to the module has a sloping (e.g., conical or wedge) shaped head so that gas bubbles can readily escape during brazing, thus reducing voids in the braze.

REFERENCES:
patent: 2163209 (1939-06-01), Pungel
patent: 2413370 (1946-12-01), Palmer
patent: 2563107 (1951-08-01), Fanger
patent: 2638525 (1953-05-01), Candy
patent: 2858414 (1958-10-01), Dash
patent: 4115019 (1978-09-01), Swisher
patent: 4130751 (1978-12-01), Gordon

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