Pin-finned forged heat sink

Details Pin-finned forged heat sink Pin-finned forged heat sink

Filed on

1993-07-09

Date issued

1994-11-29

Examiner

Limanek, Robert P.

Patent Class

Active solid-state devices (e.g., transistors, solid-state diode

SubClass

Housing or package

SubSubClass

With provision for cooling the housing or its contents

Other Related Categories

257721, 361697, 361702, 361703, 165 803, 16510433, H01L 2302

Type

Patent

Status

active

Patent number

053693019

Description

ABSTRACT:
Pin-finned heat sink having good heat dissipating characteristics satisfy the following inequality: ##EQU1## where d is the diameter of pins, c is the distance between pins, and h is the height of pins. This heat sink can increase the level of integration of semiconductor devices with which it is used.

REFERENCES:
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patent: 3961666 (1976-06-01), Suzuki et al.
patent: 4296455 (1981-10-01), Leaycraft et al.
patent: 4459638 (1984-07-01), Brehm et al.
patent: 4694378 (1987-09-01), Nakayama et al.
patent: 4698663 (1987-10-01), Sumitomo et al.
patent: 4823869 (1989-04-01), Arnold et al.
patent: 4879891 (1989-11-01), Hinshaw
patent: 4884331 (1989-12-01), Hinshaw
patent: 4884631 (1989-12-01), Rippel
patent: 4899210 (1990-02-01), Lorenzetti et al.
patent: 5003429 (1991-03-01), Baker et al.
patent: 5083194 (1992-01-01), Bartilson
patent: 5155579 (1992-10-01), AuYeung
"The Application of Two-Phase Push-Pull Cooling Made in Pin-fin Array Electronic Device", Yu-Lin Chao and Fang-Lin Chao, (Eighth Annual IEEE Semi Conductor Thermal Management Symposium, Feb. 3-5, 1992) pp. 97-100.
Electronics International, S. W. Fields, "Grooved Substrate Boosts IC Cooling"; vol. 55, No. 17, Aug. 1982, pp. 46-48.

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