Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1993-07-09
1994-11-29
Limanek, Robert P.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257721, 361697, 361702, 361703, 165 803, 16510433, H01L 2302
Patent
active
053693019
ABSTRACT:
Pin-finned heat sink having good heat dissipating characteristics satisfy the following inequality: ##EQU1## where d is the diameter of pins, c is the distance between pins, and h is the height of pins. This heat sink can increase the level of integration of semiconductor devices with which it is used.
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"The Application of Two-Phase Push-Pull Cooling Made in Pin-fin Array Electronic Device", Yu-Lin Chao and Fang-Lin Chao, (Eighth Annual IEEE Semi Conductor Thermal Management Symposium, Feb. 3-5, 1992) pp. 97-100.
Electronics International, S. W. Fields, "Grooved Substrate Boosts IC Cooling"; vol. 55, No. 17, Aug. 1982, pp. 46-48.
Hayashi Chihiro
Ohminato Kimihiko
Limanek Robert P.
Ostrowski David
Sumikin Precision Forge Inc.
Sumitomo Metal Industries Ltd.
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