Pillar structure on bump pad

Details Pillar structure on bump pad Pillar structure on bump pad

2011-08-16

2011-08-16

Thai, Luan C (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Solder wettable contact, lead, or bond

C257S780000, C257SE23021, C257SE23023

Reexamination Certificate

active

07999395

ABSTRACT:
Substrates including conductive pads for coupling the substrates to a microelectronic device and/or package are described herein. Embodiments of the present invention provide substrates comprising one or more conductive pads including a base portion and a pillar portion, the pillar portion being configured to couple with a microelectronic device. According to various embodiments of the present invention, the substrate may be a printed circuit board and/or may be a carrier substrate incorporated into an electronic package. The pillar portion may facilitate interconnection between the substrate and a microelectronic device or package by effectively raising the height of the conductive pad. Other embodiments may be described and claimed.

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