Piezoelectric device and cover sealing method and apparatus...

Details Piezoelectric device and cover sealing method and apparatus... Piezoelectric device and cover sealing method and apparatus...

2006-06-13

2006-06-13

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S118000, C438S125000

Reexamination Certificate

active

07060520

ABSTRACT:
The invention provides a method of sealing piezoelectric devices with covers capable of rapidly and securely sealing a plurality of packages or many packages of piezoelectric devices with covers. A piezoelectric device includes a package in which a piezoelectric vibrating reed is partially supported and fixed, and a cover fixed to the packages. In a method of sealing the packages with the covers, a plurality of the packages are arranged with the bottoms facing halogen lamps, so that the bottoms are irradiated with the light beams from the halogen lamps to thermally melt a brazing material disposed between the packages and the covers.

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