Piezo-TFT cantilever MEMS

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal

Reexamination Certificate

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Details

C257S415000, C257S417000, C257S418000, C438S048000, C438S050000, C438S052000

Reexamination Certificate

active

11031320

ABSTRACT:
A piezo-TFT cantilever microelectromechanical system (MEMS) and associated fabrication processes are provided. The method comprises: providing a substrate, such as glass for example; forming thin-films overlying the substrate; forming a thin-film cantilever beam; and simultaneously forming a TFT within the cantilever beam. The TFT is can be formed least partially overlying a cantilever beam top surface, at least partially overlying a cantilever beam bottom surface, or embedded within the cantilever beam. In one example, forming thin-films on the substrate includes: selectively forming a first layer with a first stress level; selectively forming a first active Si region overlying the first layer; and selectively forming a second layer overlying the first layer with a second stress level. The thin-film cantilever beam is formed from the first and second layers, while the TFT source/drain (S/D) and channel regions are formed from the first active Si region.

REFERENCES:
patent: 3582690 (1971-06-01), Yerman
patent: 6040611 (2000-03-01), De Los Santos et al.
patent: 6630367 (2003-10-01), Kubena et al.
Vinayak P Dravid and Gajendra S Shekhawat; “MOSFET Integrated Microcantilevers for Novel Electronic Detection of “On-Chip” Molecular Interactions”, Material Science, Northwestern University, Evanston, Illinois, Apr. 14, 2004.
Joao Gaspar, Haohua Li, Paulo Peieiro Freitas, “Integrated Magnetic Sensing of Electro-statically Actuated Thin-Film Microbridges”, Journal of MicroElectroMechanical Systems, vol. 12, No. 5, Oct. 2003, p. 550-556.

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