Physical vapor deposition dual coating process

Details Physical vapor deposition dual coating process Physical vapor deposition dual coating process

1988-08-25

1993-08-10

Weisstuch, Aaron

Chemistry: electrical and wave energy

Processes and products

Vacuum arc discharge coating

20419212, 20419213, 20419216, 20419227, 20429803, 20429826, 20429841, C23C 1434, C23C 1432

Patent

active

052345610

ABSTRACT:
A machine for covering a substrate (FIG. 14, 540) by means of both cathodic arc plasma deposition (CAPD) (FIG. 2) and magnetron sputtering (FIG. 1) without breaking vacuum in a single chamber (FIG. 14, 421). A computer system monitors (FIG. 3, 403, 405) and controls all coating process parameters to coat in any sequence multiple thin film layers using either the CAPD or magnetron sputtering process. A rotating substrate table (FIG. 14, 470) used in conjunction with internal and external targets coats both sides of the substrate simultaneously.

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Technical Note: A Review of Cathodic Arc Plasma Deposition Processes and Their Applications, Surface and Coating Technology, vol. 31, 303-318 (1987).

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