Physical vapor deposition components and methods of formation

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Reexamination Certificate

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Details

C204S298130, C148S300000, C148S312000, C148S120000, C148S121000, C148S676000, C148S677000

Reexamination Certificate

active

07041204

ABSTRACT:
A PVD component forming method includes inducing a sufficient amount of stress in the component to increase magnetic pass through flux exhibited by the component compared to pass through flux exhibited prior to inducing the stress. The method may further include orienting a majority crystallographic structure of the component at (200) prior to inducing the stress, wherein the induced stress alone is not sufficient to substantially alter surface grain appearance. Orienting structure may include first cold working a component blank to at least about an 80% reduction in cross-sectional area. The cold worked component blank can be heat treated at least at about a minimum recrystallization temperature of the component blank. Inducing stress may include second cold work to a reduction in cross-sectional area between about 5% to about 15% of the heat treated component. At least one of the first and second cold working can be unidirectional.

REFERENCES:
patent: 4481470 (1984-11-01), Wallace
patent: 4784739 (1988-11-01), Kodokura et al.
patent: 4832810 (1989-05-01), Nakamura
patent: 5087297 (1992-02-01), Pouliquen
patent: 5282947 (1994-02-01), Brugge et al.
patent: 5334267 (1994-08-01), Taniguchi et al.
patent: 5456815 (1995-10-01), Fukuyo et al.
patent: 5590389 (1996-12-01), Dunlop et al.
patent: 5658442 (1997-08-01), Van Gogh
patent: 5741377 (1998-04-01), Goyal et al.
patent: 5798005 (1998-08-01), Murata et al.
patent: 6071389 (2000-06-01), Zhang
patent: 6086725 (2000-06-01), Abburi et al.
patent: 6123783 (2000-09-01), Bartholomeusz et al.
patent: 6258217 (2001-07-01), Richards et al.
patent: 6278271 (2001-08-01), Schott
patent: 6299740 (2001-10-01), Hieronymi et al.
patent: 6391172 (2002-05-01), Cole et al.
patent: 6454911 (2002-09-01), Xu et al.
patent: 2001/0001438 (2001-05-01), Cole et al.
patent: 0882813 (1998-12-01), None
patent: 1041170 (2000-10-01), None
patent: 2324612 (1998-10-01), None
patent: 59108970 (1984-06-01), None
patent: 8253859 (1996-01-01), None
patent: WO9824945 (1998-06-01), None
patent: WO 9848269 (1998-10-01), None
patent: WO9902750 (1999-01-01), None
patent: WO9910548 (1999-03-01), None
patent: WO 99/10548 (1999-03-01), None
patent: WO9961670 (1999-12-01), None
patent: WO 00/40770 (2000-04-01), None
patent: PCT/US01/16410 (2001-11-01), None
patent: WO 02/086183 (2002-10-01), None
patent: WO02/086183 (2002-10-01), None
Derwent Abstract GB 2353294A.

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