4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

Matthew S. Cooper

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Methods of forming physical vapor deposition target/backing...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Physical vapor deposition components and methods of formation

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
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Physical vapor deposition target/backing plate assemblies

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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