Physical vapor deposition clamping mechanism and heater/cooler

Heat exchange – With retainer for removable article

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Details

29 2501, 118 69, 118728, F28F 700

Patent

active

052285014

ABSTRACT:
A clamping ring and temperature regulated platen for clamping a wafer to the platen and regulating the temperature of the wafer. The force of the clamping ring against the wafer is produced by the weight of the clamping ring. A roof shields all but a few contact regions of the interface between the wafer and clamp from receiving depositing particles so that a coating formed on the wafer makes continuous contact with the clamping ring in only a few narrow regions that act as conductive bridges when the depositing layer is conductive.

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