Semiconductor device manufacturing: process – Including control responsive to sensed condition
Reexamination Certificate
2007-02-27
2007-02-27
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Including control responsive to sensed condition
C438S010000, C438S014000, C257SE21521
Reexamination Certificate
active
10848925
ABSTRACT:
Nano-machining for circuit edits through the front side or backside of an integrated circuit may be performed using a scanning probe system. The system may create access holes with smaller dimensions and facilitate nano-machining endpoint detection in some embodiments.
DiBattista Michael
Livengood Richard H.
Varner Elizabeth B.
White Randall C.
Geyer Scott B.
Trop Pruner & Hu P.C.
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