Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1988-11-22
1990-07-24
Michl, Paul R.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430287, 430286, 430288, 430281, 430271, 430313, 430325, 430330, 522103, 522 26, 528113, 427 431, 427177, G03F 7027, G03C 172
Patent
active
049435167
ABSTRACT:
A photosensitive thermosetting resin composition, comprising (A) a photosensitive prepolymer containing at least two ethylenically unsaturated bonds in the molecular unit thereof, (B) a photoinitiator, (C) a photopolymerizable vinyl monomer and/or an organic solvent as a diluent, (D) a finely powdered epoxy compound containing at least two epoxy groups in the molecular unit thereof and exhibiting sparing solubility in the diluent to be used, and optionally (E) a curing agent for epoxy resin, excels in developing property and sensitivity and enjoys a long shelf life.
By subjecting this photosensitive thermosetting resin composition to coating, exposure, development, and postcuring, there can be formed a solder resist pattern which excels in adhesion, insulation resistance, resistance to electrolytic corrosion, resistance to soldering temperature, resistance to chemicals, and resistance to plating.
REFERENCES:
patent: 3989610 (1976-11-01), Tsukada et al.
patent: 4105518 (1978-08-01), McGinniss
patent: 4162274 (1979-07-01), Rosenkranz
patent: 4216246 (1980-08-01), Iwasaki et al.
patent: 4358477 (1982-11-01), Noomen et al.
patent: 4428807 (1931-01-01), Lee et al.
patent: 4479983 (1984-10-01), Appelt et al.
Inagaki Shoji
Kamayachi Yuichi
Sawazaki Kenji
Suzuki Morio
Chu John S. Y.
Kananen Ronald P.
Michl Paul R.
Taiyo Ink Manufacturing Co., Ltd.
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