Photosensitive resins, resin compositions and products of...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S285100, C430S908000, C430S916000, C430S009000, C430S271100, C430S321000, C525S921000

Reexamination Certificate

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10505600

ABSTRACT:
A photosensitive resin (A) consisting substantially of a product obtained by reacting a polyester (c) which is a reaction product of a polyol (a) with a tetrabasic acid dianhydride (b) with a compound (d) having an ethylenically unsaturated group and an epoxy group in the molecule; an alkali-soluble photosensitive resin (AA) obtained by reacting the photosensitive resin (A) with a di- or tri-basic acid mono-anhydride (e); photosensitive resin compositions prepared by incorporating the above photosensitive resin with a diluent (XX), a crosslinking agent (B) and/or a photopolymerization initiator (C); products of curing of the compositions; and articles equipped with these products. The resins and resin compositions give cured articles which are suitable for the formation of optical waveguides and excellent in processability, transparency, developability, close adhesion, resistance to soldering heat, and so on.

REFERENCES:
patent: 3923523 (1975-12-01), Nishikubo et al.
patent: 5194327 (1993-03-01), Takahashi et al.
patent: 11-337752 (1999-12-01), None
patent: 2001-051415 (2001-02-01), None
patent: 2002-138140 (2002-05-01), None
patent: 2003-2958 (2003-01-01), None
Partial, machine-assited English translation of Jp 2002-138140 (Koyanagi et al), provided by JPO.
Chemical Abstract for JP 2003-2958 (Koyanagi et al).
Derwent Abstract for JP 2003-2958 (Koyanagi et al).
Machine-assisted English translation of JP 2003-2958 (Koyanagi et al), provided by JPO.

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