Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2000-03-29
2004-06-01
Huff, Mark (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S273100
Reexamination Certificate
active
06743569
ABSTRACT:
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a photosensitive resin laminate suitably used for a sign plate, such as display panel, decoration shield, name plate, Braille slate and the like, and a production method thereof, by which the photosensitive resin laminate affords a sign plate and the like that are characterized by superior production efficiency, absence of odor during processing, superior adhesive property and particularly excellent design.
BACKGROUND OF THE INVENTION
A photosensitive resin laminate for a sign plate, which is obtained by exposing a photosensitive resin layer through a pattern and developing the layer, has been disclosed in JP-A-58-55927, JP-A-9-6267 and the like. This laminate has been used for a display panel having a relief, a sign plate carrying Braille and the like.
However, sign plates for use in these days are required to stand bending during processing, to be transparent and the like. The widely used photosensitive resin laminates having a phenol support are not suitable for bending processing or producing transparent sign plates. Accordingly, there has arisen a demand on a photosensitive resin laminate suitable for processing into a sign plate having a good design.
Conventional photosensitive resin laminates have been produced by a method such as solution cast, melt extrusion, thermal compression and the like. However, solution cast, melt extrusion and some other methods are associated with difficulty in that a laminate to be processed is so thick or stiff that the support does not deform, and therefor, does not follow the roller that transports the laminate during processing. When the support to be laminated is not in a single solid sheet, the discontinuity of the support easily causes loss of a resin to be used.
It is therefore an object of the present invention to afford a photosensitive resin laminate for a sign plate, such as display panel, decoration shield, name plate, Braille slate and the like, particularly, a photosensitive resin laminate for a sign plate with a good design, which permits bending during processing of a sign plate and processing into a transparent sign plate, a photosensitive resin laminate free of generation of odor from the support and having superior resistance to the solvent used for processing, and a production method of a photosensitive resin laminate that affords efficient production of the laminate having a thick support, a stiff support or support in a number of sheets.
SUMMARY OF THE INVENTION
Such object can be achieved by the following invention.
According to the present invention, there is provided a photosensitive resin laminate comprising a photosensitive resin layer and a support, the photosensitive resin layer being directly or via an adhesive layer formed on the support, wherein the support has a Shore D hardness of not less than 35°, a thickness of not less than 1 mm and a total light transmission of not less than 70%. A photosensitive resin laminate having the above-mentioned characteristics, wherein the support has a thermal deformation temperature of 60° C.-90° C., or the support is made from a polyethylene terephthalate resin, a modified polyethylene terephthalate resin, an acrylic resin or a modified acrylic resin, affords particularly superior effects.
When a solid photosensitive resin layer is press laminated on a support having a Shore D hardness of not less than 35° and a thickness of not less than 1 mm in the presence of a solvent that dissolves or swells the photosensitive resin layer, in the interface between the support and the photosensitive resin layer, or when the photosensitive resin layer to be laminated is heated before press lamination to a temperature of not less than the softening point of the resin and less than the melting temperature of the resin, the above-mentioned photosensitive resin laminate can be obtained particularly efficiently.
DETAILED DESCRIPTION OF THE INVENTION
The present invention is explained in detail in the following.
The support of the present invention has a thickness of not less than 1 mm, preferably a thickness suitable for use and design is chosen from the range of 1 mm-10 mm. When the thickness is less than 1 mm, the support tends to warp, which is unsuitable for use as a sign plate, whereas when the thickness exceeds 10 mm, the support cannot be cut easily and becomes heavy.
The support needs to have a Shore D hardness of not less than 35°. By the Shore D hardness is meant the hardness as measured by a Shore durometer by way of the length of the part of a needle, that had been pressed into a specimen upon application of a load (4536 g).
The preferable range of the Shore D hardness is not less than 55°, particularly not less than 70°. When the Shore D hardness is less than 35°, the support unpreferably warps and the sign plate obtained therefrom does not have sufficient supporting function.
The total light transmission according to ASTM D-1003 of the support in the present invention is not less than 70%.
The preferable range of the total light transmission is not less than 75%, particularly desirably not less than 80%. When the transmission is less than 70%, the processed products, such as a sign plate and the like, will be low-graded, which in turn makes it difficult to obtain products with good design.
The thermal deformation temperature according to ASTM D-648 of the support is preferably 60° C.-90° C. More preferably, thermal deformation temperature is 70° C.-80° C. When it is less than 60° C., the laminate is deformed during development and drying in a plate making step, and when it exceeds 90° C., the workability during processing of the laminate into a final product, such as a sign plate and the like, lowers.
A support having the aforementioned characteristics is prepared from a polyethylene terephthalate resin, an acrylic resin and the like. These resins may be copolymers, blends of polymers, resins modified by adding an additive such as a plasticizer, and the like.
Particularly, a polyethylene terephthalate resin and a modified polyethylene terephthalate resin are preferably used. When transparency is desired or good processability, particularly cutting property, is desired, a modified polyethylene terephthalate resin is preferable.
A polyethylene terephthalate resin can be modified by copolymerization with a glycol component or dicarboxylic acid component, blending with modified polyethylene terephthalate and the like. In consideration of the strength and stability of the resin, copolymerization is preferable.
The glycol component to be copolymerized may be, for example, butanediol, hexanediol, neopentyl glycol, 1,4-cyclohexyldimethanol and the like. Examples of the dicarboxylic acid component include adipic acid, sebacic acid, isophthalic acid, 1,4-cyclohexyldicarboxylic acid and the like. The amount of the components to be copolymerized is 5-40 mol %, particularly 10-30 mol %, of the resin.
The photosensitive resin composition constituting the photosensitive resin layer may be any that is known. Specific examples include a photosensitive resin composition containing a soluble high molecular weight compound (e.g., polyvinyl alcohol, polyamide, polyether ester amide, polyether amide, polyurethane and the like), a photopolymerizable or photocrosslinkable monomer (e.g., acrylate of polyhydric alcohol, epoxy acrylate of polyhydric alcohol, N-methylolacrylic amide and the like), a photopolymerization initiator (e.g., benzyldimethyl ketal, benzoindimethyl ether and the like), and heat stabilizer, plasticizer, surfactant, dye and the like on demand, and the like.
To be specific, a resin that can be a binder to a photosensitive resin composition containing polyether amide (e.g., JP-A-55-79437 and the like), a photo sensitive resin composition containing polyether ester amide (e.g., JP-A-58-113537 and the like), a photosensitive resin composition containing tertiary nitrogen-containing polyamide (e.g., JP-A-50-76055 and the like), a photosensitive resin solution obtained by dissolving ammonium salt type tertiary nitrogen ato
Motoi Keiichi
Taguchi Yuji
Huff Mark
Lee Sin J.
Morrison & Foerster / LLP
Toyo Boseki Kabushiki Kaisha
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