Photosensitive resin containing a combination of diphenyl-imiazo

Details Photosensitive resin containing a combination of diphenyl-imiazo Photosensitive resin containing a combination of diphenyl-imiazo

1981-04-03

1983-10-18

Brammer, Jack P.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

20415915, 20415918, 20415923, 20415924, 430286, 430287, 430288, 430920, 430922, G03C 168

Patent

active

044106211

ABSTRACT:
A photosensitive resin composition which comprises (1) an ethylenically unsaturated compound which can be addition polymerized to form a high molecular compound, said addition polymerization being initiated by a free radical and chain-propagating, (2) a 2-polycyclic aryl-4,5-diphenylimidazolyl dimer wherein the polycyclic aryl group at the 2-position comprises at least two benzene rings condensed each other and (3) a heterocyclic mercaptan compound, said photosensitive resin composition being excellent in having a high photopolymerization initiation potency.

REFERENCES:
patent: 3479185 (1969-11-01), Chambers
patent: 4252887 (1981-02-01), Dessauer

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