Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1998-09-29
2000-09-05
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
4302871, 430926, 430920, 430922, 430919, 430947, 522 13, 522 16, 522 24, 522 26, 522 29, 522103, G03F 7031, G03F 7038
Patent
active
061140929
ABSTRACT:
A photosensitive resin composition for photoresist which is highly sensitive and can directly form an image using a laser is disclosed. Said composition comprises (A) an unsaturated resin having carboxyl group(s) which is obtained by firstly reacting 0.8 to 1.3 moles of an ethylenic unsaturated monocarboxylic acid with 1 mole of an epoxy group of a homopolymer or copolymer of ethylenic unsaturated monomer having an epoxy group to obtain an unsaturated resin which is then reacted with a dibasic acid anhydride, (B) ethylenic unsaturated compound without epoxy group, and (C) photopolymerization initiator.
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L. Roos, Printed Circuit World Convention IV," Argon Laser-Imageable, Dry Film Photoresist" (Jun. 1987).
K. Ozeki et al., Gists of the 1.sup.st Academic Lecture Meeting of Printed Circuit Society, pp. 91-92.
Kansai Paint, 1998-366843, English Abstract of JP 10142790A, published May 29, 1998, Derwent Information LTD obtained on West 1.1 A database, 2 pages.
Kansai Paint, 129: 128994, English Abstract of JP 10142790A, published May 29, 1998, Chemical Abstracts Online, ACS obtained on STN database, 2 pages .
Miyagawa Kenji
Seko Kenji
Hamilton Cynthia
Kansai Paint Co. Ltd.
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