Radiation imagery chemistry: process – composition – or product th – Imaged product – Including resin or synthetic polymer
Reexamination Certificate
2006-10-31
2006-10-31
Chu, John S. (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaged product
Including resin or synthetic polymer
C430S270100, C430S325000, C430S330000, C430S905000
Reexamination Certificate
active
07129011
ABSTRACT:
A heat resistant negative working photosensitive composition that comprises(a) one or more polybenzoxazole precursor polymers (I): wherein x is an integer from about 10 to about 1000, y is an integer from 0 to about 900 and (x+y) is about less then 1000; Ar1is a tetravalent aromatic group, a tetravalent heterocyclic group, or mixtures thereof; Ar2is a divalent aromatic, a divalent heterocyclic, a divalent alicyclic, or a divalent aliphatic group that may contain silicon; Ar3is a divalent aromatic group, a divalent aliphatic group, a divalent heterocyclic group, or mixtures thereof; Ar4is Ar1(OH)2or Ar2; G is a monovalent organic group a carbonyl, carbonyloxy or sulfonyl group;(b) one or more photo-active compounds which release acid upon irradiation (PAGs);(c) one or more latent crosslinkers each of which contains at least two ˜N—(CH2OR)nunits (n=1 or 2, wherein R is a linear or branched C1–C8alkyl group);(d) at least one solvent, and(e) at least one dissolution rate modifier,with the proviso that when the latent crosslinker is highly reactive, the dissolution rate modifier does not contain carboxylic acid groups.
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Hopla Richard
Naiini Ahmad A.
Powell David B.
Rushkin Il'ya
Waterson Pamela J.
Arch Specialty Chemicals, Inc.
Chu John S.
Ohlandt Greeley Ruggiero & Perle LLP
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