Photosensitive resin compositions

Details Photosensitive resin compositions Photosensitive resin compositions

1987-06-19

1988-08-16

Schofer, Joseph L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430285, 430286, 430910, 522121, 522122, G03C 168

Patent

active

047644524

ABSTRACT:
The present invention provides a photosensitive resin composition comprising (a) 10-60 wt. % of a styrene--maleic acid copolymer or its partially esterified product having a molecular weight of 1,000-3,000 and an acid value of 50-500, (b) 1-30 wt. % of acrylate or methacrylate having a tetrahydrofurfuryl group or a hydroxyl group, (c) 1-30 wt. % of diacrylate or dimethacrylate of polyethyleneglycol or polypropylene glycol, (d) 1-40 wt. % of a monoester compound represented by the following general formula (I), (II), (III), (IV) or (V). ##STR1## (wherein, X stands for a divalent organic group, preferably an alkylene group having carbon atoms of 1-4 or --C.sub.n H.sub.2n O--.sub.p CH.sub.2 group wherein n is an integer of 2-6 and p is an integer of 1-19; Y stands for hydrogen atoms or a methyl group; and Y' stands for hydrogen atoms or an alkyl group having carbon atoms of 1-4.).

REFERENCES:
patent: 4370403 (1983-01-01), Takaki

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