Photosensitive resin composition which is improved with respect

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

430281, 430306, 522 96, 522 78, 522 79, G03C 168, G03C 170

Patent

active

047160942

ABSTRACT:
A photosensitive resin composition which is improved with respect to surface tack-free characteristic after curing by exposure to actinic radiation is disclosed. Further, there is disclosed a method of preparing a surface-tack free photocured pattern structure using the photosensitive resin composition, which enables pattern structures improved with respect to surface tack-free characteristic to be obtained in a shortened period of time.

REFERENCES:
patent: 3157501 (1964-11-01), Burrows et al.
patent: 3887379 (1975-06-01), Clecak et al.
patent: 4036644 (1977-07-01), Kaplan et al.
patent: 4057431 (1977-11-01), Finelli et al.
patent: 4139436 (1979-02-01), Jasani
patent: 4168981 (1979-09-01), Donald et al.
patent: 4218294 (1980-08-01), Brack
patent: 4259432 (1981-03-01), Kondoh et al.
patent: 4268576 (1981-05-01), Montmarquet, Jr.
patent: 4292392 (1981-09-01), Ikeda et al.
patent: 4323637 (1982-04-01), Chen et al.
patent: 4386153 (1983-05-01), Shinozaki et al.
patent: 4481281 (1984-11-01), Tsao et al.
Chemical Abstract, vol. 87, No. 16, p. 63, No. 118959u.
Chemical Abstract, vol. 86, No. 18, p. 665, No. 131160a.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Photosensitive resin composition which is improved with respect does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition which is improved with respect , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition which is improved with respect will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-462783

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.