Photosensitive resin composition, resist composition,...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S270100, C430S296000, C430S313000, C430S311000, C430S942000

Reexamination Certificate

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07122297

ABSTRACT:
There are provided a photosensitive resin composition containing at least a polymer compound having a sugar structure, which has at least two species of functional groups cleavable in the presence of an acid, and a photo acid generator generating an acid by radiation of an electromagnetic wave or a beam of an electrically charged particle, and in addition, a resist composition, a method for fabricating a patterned substrate for fabricating a semiconductor device and the like, and a device such as a highly integrated semiconductor and the like.

REFERENCES:
patent: 5585219 (1996-12-01), Kaimoto et al.
patent: 5716740 (1998-02-01), Shiba et al.
patent: 5981135 (1999-11-01), Koes et al.
patent: 0848290 (1998-06-01), None
patent: 5-80515 (1993-04-01), None
patent: 5-265212 (1993-10-01), None
patent: 6-34412 (1994-02-01), None
patent: 10-213903 (1998-08-01), None
Patent Abstract of Japan, vol. 1995, No. 3 (Apr. 1995) for JP 6-342,212.
Database WPI, Section Ch. Week 199611, Derwent Publication, AN 1996-101274, XP002194982 (JP8-6252) Jan. 1996.

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