Photosensitive resin composition, process of forming...

Details Photosensitive resin composition, process of forming... Photosensitive resin composition, process of forming...

2005-02-01

2005-02-01

Schilling, Richard L. (Department: 1752)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S287100, C430S906000, C430S325000

Reexamination Certificate

active

06849385

ABSTRACT:
There are disclosed a photosensitive resin composition comprising:at least one photosensitive resin among a polyamide resin (A) having a repeating unit (U1) represented by general formula (I) below and a polyamideimide resin (B) having a repeating unit (U2) represented by general formula (II); andat least one photopolymerizable compound among a silane coupling agent (C) having a photopolymerizable unsaturated bond and a photopolymerizable unsaturated monomer (D) comprising a monomer (d1) having at least 5 photopolymerizable unsaturated bonds per molecule General formula (I):(in the formula, X1denotes a trivalent organic group having an aromatic ring, Y1denotes a divalent organic group having an aromatic ring, and R1denotes a monovalent organic group having a photosensitive group) General formula (II):(in the formula, X2and Y2denote trivalent organic groups having an aromatic ring, and R2denotes a monovalent organic group having a photosensitive group), a pattern production process using same, and an electronic component.

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International Search Report dated Oct. 1, 2002, for International Application No. PCT/JP02/06733.

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