Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2005-11-01
2005-11-01
Le, Hoa Van (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S283100, C430S330000
Reexamination Certificate
active
06960420
ABSTRACT:
A photosensitive resin composition is disclosed that includes (A) a heat-resistant polymer of the general formula (1):(where the symbols are as defined in the specification), (B) a photoreactive compound, and (C) a solvent. A relief pattern is formed from the composition by applying the composition to a support substrate and drying it to form a photosensitive resin film; exposing the dried film; developing the exposed film using an alkaline aqueous solution; and heating the developed photosensitive resin film. Also disclosed is an electronic component that includes an electronic device having such a pattern.
REFERENCES:
patent: 4339521 (1982-07-01), Ahne et al.
patent: 54109828 (1979-08-01), None
patent: 146862 (1989-10-01), None
patent: 11109620 (1999-04-01), None
patent: 11143070 (1999-05-01), None
Machine English language translation of JP 2002012665 A2 20020115 with respect to Claims and Detailed Description.
Computer generating chemical structure search of JP 2002012665, Nov. 17, 2004.
Antonelli, Terry Stout and Kraus, LLP.
Hitachi Chemical Dupont Microsystem L.L.C.
Hitachi Chemical Dupont Microsystems LTD
Le Hoa Van
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