Photosensitive resin composition, photosensitive resin...

Details Photosensitive resin composition, photosensitive resin... Photosensitive resin composition, photosensitive resin...

2011-07-12

2011-07-12

Lee, Sin J. (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S281100, C430S286100, C430S287100, C430S921000, C430S925000, C430S926000, C430S271100, C430S273100, C430S325000, C430S330000

Reexamination Certificate

active

07977030

ABSTRACT:
A photosensitive resin composition, a photosensitive resin laminate, and a method for forming a pattern capable of realizing high hardness while using an epoxy group-containing acrylic resin are provided. In a photosensitive resin composition including (A) an epoxy group-containing acrylic resin, (B) a photopolymerization initiator, and (C) a sensitizer, an onium salt having a specific structure is used as the component (B), and at least one kind selected from 1,5-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, and 2,6-dihydroxynaphthalene is used as the component (C).

REFERENCES:
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patent: 2004/0152857 (2004-08-01), Ohnishi et al.
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patent: 2003-212956 (2003-07-01), None
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patent: WO2008/007764 (2008-01-01), None
Derwent English abstract for WO 2008/007764 A1.
Notice of Reasons for Rejection issued to corresponding KR Application No. 10-2008-0048534, mailed Oct. 20, 2010.

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