Photosensitive resin composition, photosensitive element...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S910000, C430S920000, C430S919000, C430S924000, C430S925000, C430S271100, C430S311000, C430S313000, C430S325000, C430S945000

Reexamination Certificate

active

11084092

ABSTRACT:
The present invention provides a photosensitive resin composition for laser scanning exposure, which satisfies the following formula (1):-25≦E1-E0E0×100≦25(1)wherein E0represents an exposure amount in mJ/cm2at which the photosensitive resin composition is cured at the 21st step of the density 1.00 of a 41-step step tablet having a density range from 0.00 to 2.00, a density step of 0.05, a tablet size of 20 mm×187 mm and a step size of 3 mm×12 mm, by irradiation with a full wavelength active light of a high pressure mercury lamp and E1represents an exposure amount in mJ/cm2at which the photosensitive resin composition after being left for 2 hours under 40 W non-ultraviolet white lamp is cured at the 21st step of the 41-step step tablet by irradiation with a full wavelength active light from a high pressure mercury lamp.

REFERENCES:
patent: 4943516 (1990-07-01), Kamayachi et al.
patent: 5942372 (1999-08-01), West et al.
patent: 6180319 (2001-01-01), McKeever
patent: 6844137 (2005-01-01), Fujimaki et al.
patent: 8-76369 (1996-03-01), None
patent: 8-220759 (1996-08-01), None
patent: 08-314138 (1996-11-01), None
patent: 9-309907 (1997-12-01), None
patent: 10-110008 (1998-04-01), None
patent: 10-123708 (1998-05-01), None
patent: 11-100408 (1999-04-01), None
patent: 11-327137 (1999-11-01), None
patent: 2000-310855 (2000-11-01), None
patent: 2001-194782 (2001-07-01), None
patent: 2001-201851 (2001-07-01), None
Full, formal English translation of JP 08-220759 provided by PTO.
English translation for JP 8-76369 provided by PTO.

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