Photosensitive resin composition, photosensitive element...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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C430S281100, C430S286100, C430S313000, C430S320000, C430S323000, C430S324000, C430S325000

Reexamination Certificate

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07067228

ABSTRACT:
A photosensitive resin composition which comprises (A) a binder polymer, (B) a photopolymerizing compound having at least one ethylenic unsaturated bond in the molecule and (C) a photopolymerization initiator, wherein the binder polymer as component (A) comprises two or more binder polymers and/or has a dispersity of 2.5-6.0, and wherein the photopolymerizing compound as component (B) has in the molecule at least one ethylene glycol chain and at least one C3-C6alkylene glycol chain.

REFERENCES:
patent: 5922509 (1999-07-01), Kautz et al.
patent: 63-184744 (1988-07-01), None
patent: 05-341527 (1993-12-01), None
patent: 06242603 (1994-09-01), None
patent: 06-242603 (1994-09-01), None
patent: 07-319153 (1995-12-01), None
patent: 11184081 (1999-07-01), None
patent: 11-223944 (1999-08-01), None
patent: 11-327137 (1999-11-01), None
patent: 2001159817 (2001-06-01), None
Machine Translations of JP 06-242603, and JP 2001-159817.
Chinese Office Action, received Aug. 20, 2004.
JP11327137A2: English Abstract by Delphion, www.delphion.com, 2 pages.
Office Action from the Taiwanese Patent Office, 3 pages, issued on Mar. 9, 2004.

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