Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-08-09
2011-08-09
Walke, Amanda C. (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S913000, C430S905000, C430S945000, C430S915000, C430S920000, C430S311000
Reexamination Certificate
active
07993809
ABSTRACT:
A photosensitive resin composition comprising: (A) a binder polymer; (B) a photopolymerizable compound that has an ethylenically unsaturated bond; and (C1) a compound represented by general formula (1) below,wherein, at least one R represents a C1-10alkoxy group or a C1-12alkyl group; the sum of a, b, and c is 1 to 6; and when the sum of a, b, and c is 2 to 6, each R may be the same as or different from one another.
REFERENCES:
patent: 5221595 (1993-06-01), Lingnau et al.
patent: 5236812 (1993-08-01), Vassiliou et al.
patent: 5935761 (1999-08-01), Hwang et al.
patent: 6207345 (2001-03-01), Kimura et al.
patent: 6855480 (2005-02-01), Wheeler et al.
patent: 7338751 (2008-03-01), Akahori et al.
patent: 2002/0018962 (2002-02-01), Urano et al.
patent: 1205784 (1999-01-01), None
patent: 55-075405 (1980-06-01), None
patent: 4-223470 (1992-08-01), None
patent: 5-179226 (1993-07-01), None
patent: 2000-338659 (2000-12-01), None
patent: 2002-296764 (2002-10-01), None
patent: 2002-351070 (2002-12-01), None
patent: 2003-215799 (2003-07-01), None
patent: 2004-045596 (2004-02-01), None
patent: 2005-215142 (2005-08-01), None
patent: 557415 (2003-10-01), None
patent: 562997 (2003-11-01), None
English language machine translation of JP 05-179226.
Translation of the International Preliminary Report on Patentability for Application No. PCT/JP2006/310134, dated Dec. 6, 2007.
Search Report and Written Opinion dated Dec. 12, 2008, for Singapore Application No. 200717494-9, issued by the Austrian Patent Office.
Official Action issued on Aug. 26, 2008, in Application No. 10-2007-7023383.
Taiwanese Official Action dated Dec. 9, 2009, for Application No. 095118300.
Chinese Official Action issued May 5, 2010, for Application No. 200680017652.X.
Japanese Official Action issued Feb. 9, 2010, for Application No. 2006-141895.
Korean Notice of Allowance issued Mar. 5, 2010, for Application No. 10-2009-7021746.
PENTAX Corporation,PENTAX Press News, “PENTAX DI-2080”, Module substrate data direct imaging system, Product specifications sheet, pp. 1 and 2, 2003.
Kumaki Takashi
Miyasaka Masahiro
Antonelli, Terry Stout & Kraus, LLP.
Hitachi Chemical Company Ltd.
Walke Amanda C.
LandOfFree
Photosensitive resin composition, photosensitive element,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin composition, photosensitive element,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition, photosensitive element,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2653669