Photosensitive resin composition for use in forming a relief str

Details Photosensitive resin composition for use in forming a relief str Photosensitive resin composition for use in forming a relief str

1992-12-30

1994-08-09

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430 18, 522 96, G03C 1725

Patent

active

053365852

ABSTRACT:
A photosensitive resin composition for use in forming a relief structure, which comprises, in specific proportions, a liquid photosensitive resin component comprising a urethane prepolymer and an addition-polymerizable ethylenically unsaturated monomer; a photopolymerization initiator; a thermal polymerization inhibitor; and a specific unsaturated amine compound. The photosensitive resin composition exhibits excellent performances such that it does not suffer from tunnel phenomenon which is frequently observed in relief formation with respect to conventional photosensitive resin compositions, so that a photoresin relief structure made therefrom not only is characterized with a tunnel-free structure and excellent mechanical properties, but also exhibits excellent performances.

REFERENCES:
patent: 3960572 (1976-06-01), Ibata et al.
patent: 4006024 (1977-02-01), Ibata et al.
patent: 4418138 (1983-11-01), Curtis
patent: 4716094 (1987-12-01), Minonishi et al.

Affiliated with

Also associated with

Rating

Photosensitive resin composition for use in forming a relief str does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition for use in forming a relief str, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition for use in forming a relief str will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-215436