Photosensitive resin composition for forming conductor patterns

Details Photosensitive resin composition for forming conductor patterns Photosensitive resin composition for forming conductor patterns

1990-10-18

1995-02-07

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430270, 430271, 430281, 430286, 430287, G03C 1492

Patent

active

053874935

ABSTRACT:
A resin composition for forming conductor patterns comprising a photo curable resin, a photopolymerization initiator, a thermosetting resin, agent for the thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunctional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

REFERENCES:
patent: 3615446 (1971-10-01), Wong
patent: 3989610 (1976-11-01), Tsukada et al.
patent: 4252883 (1981-02-01), Komura et al.
patent: 4268614 (1981-05-01), Ueyama et al.
patent: 4382118 (1983-05-01), Oka
patent: 4943516 (1990-07-01), Kamayachi et al.

Affiliated with

Also associated with

Rating

Photosensitive resin composition for forming conductor patterns does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Photosensitive resin composition for forming conductor patterns , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition for forming conductor patterns will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1109624