Photosensitive resin composition comprising fullerene

Details Photosensitive resin composition comprising fullerene Photosensitive resin composition comprising fullerene

1997-09-12

1999-12-07

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430927, 522113, G03C 1492, C08J 328

Patent

active

059980893

ABSTRACT:
Disclosed are a photosensitive resin composition containing a fullerene and a polymer compound bearing a functional group which can react with the fullerene under irradiation of visible light; method for forming negative-type picture elements comprising steps of: forming a layer composed of the above composition, irradiating the layer with visible light through a photo mask having a pattern transmitting the visible light as a part of the mask to cure portions of the layer irradiated by the visible light, and removing uncured portions of the layer to form a resist film having cured portions of the pattern: and a method for producing devices comprising steps of: forming a layer of the above composition on an image-forming layer provided on a substrate, irradiating the layer with visible light through a photo mask having a pattern transmitting the visible light as a part of the mask to cure portions of the layer irradiated by the visible light, removing uncured portions of the layer to form a resist film having cured portions of the pattern, etching exposed portions of the image-forming layer, and removing the resist film. The composition and methods of the present invention enable production of negative type picture elements and devices with light of visible range.

REFERENCES:
patent: 5561026 (1996-10-01), Aoki
Smilowitz, L., Physical Review B, 47 (20) p. 13835, May 15, 1993.
Akashi, K.Y., Synthetic Metals, 70 p. 1317, 1995.
Yamakoshi, Y., J.Org.Chem., 61, p. 7236, Oct. 18, 1996.
JAPIO, WPAT English abstracts for JP 08283199.
CAPLUS,WPAT English abstracts for DE 4344840.
WPAT English abstract for JP 07084337.
Nie, B. et al., Tetrahedron Lett. 36 (21) p. 3617, 1995.

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