Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1993-10-25
1995-01-31
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430281, G03C 173
Patent
active
053858085
ABSTRACT:
The present invention provides a photosensitive resin composition which comprises as essential components:
(A) a polyamic acid having a recurring unit represented by the following formula [I]: ##STR1## wherein 0.5-50 mol % of R.sub.1 consists of a silicone diamine residue represented by the following formula [II]: ##STR2## wherein n represents an integer of 1-50, and the remainder of 50-99.5 mol % of R.sub.1 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, and a heterocyclic group, and R.sub.2 consists of an organic group selected from the group consisting of an aromatic group, an aliphatic group, an alicyclic group, a heterocyclic group, and a silicone group, and m represents 1 or 2,
(B) an amide compound having carbon-carbon double bond, and
(C) a photosensitizer.
The present invention further provides a semiconductor apparatus in which the above composition is used.
REFERENCES:
patent: 4515887 (1985-05-01), Davis
patent: 5025088 (1991-06-01), Maeda et al.
Patent Abstract of Japan, vol. 12, No. 28, (C-471) 2875, 27 Jan. 1988, & JP-A-62, Hitachi Chem. Co., 06 Aug. 1987.
Patent Abstract of Japan, vol. 13, No. 345, (P-909) 3693, 03 Aug. 1989, & JP-A-01 105241, Hitachi Chem. Co., 21 Mar. 1989.
Hirano Takashi
Sashida Nobuyuki
Takeuchi Etsu
Tokoh Akira
McCamish Marion E.
Sumitomo Bakelite Company Limited
Weiner Laura
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