Photosensitive resin composition and photosensitive dry film...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S288100, C430S945000, C430S281100, C430S910000, C522S026000, C522S027000

Reexamination Certificate

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07662541

ABSTRACT:
A photosensitive resin composition and a photosensitive dry film which are excellent in both sensitivity and stability and are well-balanced in tent strength, resolution and plating non-staining are provided. The photosensitive resin composition comprises an alkali-soluble resin (A), a photopolymerizable compound (B) and a photopolymerization initiator (C), and the polymerization initiator (C) comprises a hexaarylbisimidazole based compound (C1) and a multifunctional thiol compound (C2) as essential components. The photosensitive dry film has at least a photosensitive resin layer formed from the photosensitive resin composition on a support film.

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International Search Report for International Application No. PCT/JP2005/021939, date of mailing Jul. 13, 2007.
Notice of Decision of Rejection issued to counterpart Japanese Patent Application No. 2004-340886, mailed Jan. 20, 2009.

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