Photosensitive resin composition and photoresist ink for manufac

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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4302871, 4302851, 522 84, 522 75, 522121, G03C 172, G03C 1725, G03C 173, G03C 174

Patent

active

061365076

ABSTRACT:
A photosensitive resin composition developable with water or a diluted alkali solution comprises the following components (A) to (D). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol (meth) acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having a carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is a photopolymerization initiator. The component (D) is water. The photosensitive resin composition will be preferably used as a photoresist ink for manufacturing printed wiring boards.

REFERENCES:
patent: 4209581 (1980-06-01), Takanashi et al.
patent: 4272620 (1981-06-01), Ichimura
patent: 4564580 (1986-01-01), Ichimura et al.
European Search Report dated Jul. 5, 1999 for EP Application No. 99104757.2-1217.

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