Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
1999-05-12
2001-05-29
Hamilton, Cynthia (Department: 1752)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S311000, C430S330000, C522S084000
Reexamination Certificate
active
06238841
ABSTRACT:
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a photosensitive resin composition having photocurability, thermosetting property, and developability with water or a diluted alkali aqueous solution, which can be preferably used as a photosolder resist ink to manufacture printed wiring boards.
2. Disclosure of the Prior Art
In the past, the screen-printing method has been mainly utilized to form solder resist films on printed wiring boards. However, as excellent resolution and tightly restricted dimensional tolerances are needed in recent years, the demand for liquid-type photosolder resist inks increases in place of the screen-printing method. For example, as disclosed in Japanese Patent Early Publication No. 61-243869, No. 2-173747, No. 7-72624, or No. 9-235348, there is a photo solder resist ink including a polyfunctional epoxy compound and an ultraviolet-curable resin obtained by adding an unsaturated group and carboxyl group to a novolac-type epoxy resin or an acrylic copolymer, which is developable with a diluted alkali aqueous solution.
However, in this kind of photoresist ink, ink components are dissolved or dispersed in an organic solvent to uniformly apply the ink components on a substrate. Therefore, it is generally required to evaporate the organic solvent from the photoresist ink by predrying prior to the subsequent exposure step. Thus, when using such a photoresist ink, there are problems inherent in the use of organic solvent, for example, a poor working condition, environmental pollution and the occurrence of a fire.
SUMMARY OF THE INVENTION
The present invention concerns a photosensitive resin composition having photocurability, thermosetting property, developability with water or a diluted alkali aqueous solution, which is capable of improving the above problems. The photosensitive resin composition of the present invention contains the following components (A) to (E). That is, the component (A) is a water-soluble photosensitive resin selected from the group consisting of a first resin obtained by introducing a styryl pyridinium group into a polyvinyl alcohol polymer, a second resin obtained by introducing a styryl quinolinium group into the polyvinyl alcohol polymer, and a third resin obtained by adding N-alkylol (meth) acrylamide to the polyvinyl alcohol polymer. The component (B) is a photosensitive prepolymer having carboxyl group and at least two ethylenically unsaturated groups in molecule. The component (C) is an epoxy compound having at least two epoxy groups in one molecule. The component (D) is a photopolymerization initiator. The component (E) is water.
It is preferred that the photosensitive resin composition further contains a photopolymerizable ethylenically-unsaturated monomer as the component (F).
It is particularly preferred to use the photosensitive resin composition of the present invention as a photo solder resist ink to manufacture printed wiring boards.
These and still other objects and advantages will become apparent from the following detail description of the preferred embodiments and examples of the invention.
REFERENCES:
patent: 4001016 (1977-01-01), Rosenkranz et al.
patent: 4025348 (1977-05-01), Tsukada et al.
patent: 4272620 (1981-06-01), Ichimura
patent: 4564580 (1986-01-01), Ichimura
patent: 4610952 (1986-09-01), Crivello
patent: 5556735 (1996-09-01), Ivory et al.
patent: 0 747 770 A2 (1996-12-01), None
patent: 0 779 553 A1 (1997-06-01), None
patent: 49-5923 (1974-02-01), None
patent: 55-23163 (1980-02-01), None
patent: 55-62905 (1980-05-01), None
patent: 56-11906 (1981-02-01), None
patent: 61-243869 (1986-10-01), None
patent: 62-267302 (1987-11-01), None
patent: 2-173747 (1990-07-01), None
patent: 7-72624 (1995-03-01), None
patent: 9-235348 (1997-09-01), None
Arent Fox Kintner & Plotkin & Kahn, PLLC
Goo Chemical Co., Ltd.
Hamilton Cynthia
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