Photosensitive resin composition and adhesion promoter

Details Photosensitive resin composition and adhesion promoter Photosensitive resin composition and adhesion promoter

2011-07-12

2011-07-12

Lee, Sin J. (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

C430S325000, C430S326000, C430S905000, C430S910000, C430S914000, C430S916000

Reexamination Certificate

active

07977028

ABSTRACT:
The present invention provides a photosensitive resin composition comprising (a) an alkali-soluble resin, (b) a silicon compound having a secondary aromatic amino group and an alkoxy group, and (c) at least one selected from a photopolymerization initiator, a photo acid generator and a photo base generator. According to the present invention, it is possible to obtain a photosensitive resin composition which remarkably enhances the adhesion property with a substrate after curing without deteriorating storage stability of a solution, and does not cause peeling of a fine pattern even upon development.

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Derwent English abstract for JP61-112086 (1986).
Machine-assisted English translation of JP7-33785 as provided by JPO (1995).
Office Action in related Japanese application No. 200680024028.2 issued May 19, 2010.

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