Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1990-12-04
1991-12-17
Hamilton, Cynthia
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430286, 430283, 430907, 430910, 522110, 522 14, 522 26, 522 28, 522 43, 522 48, 522 33, G03F 7031, G03F 7033
Patent
active
050734776
ABSTRACT:
Disclosed is a photosensitive resin composition for flexographic printing which has high water developability and good mechanical strength. The resin composition comprises (A) a partially crosslinked copolymer prepared by a radical emulsion polymerization of a specific monomer mixture (B) a linear polymer having a molecular weight of at least 5,000, which has at least 30 mol % of a conjugated diene unit, (C) a basic nitrogen atom-containing compound, (D) a photopolymerizable ethylenically unsaturated monomer, and (E) a photopolymerization inhitiator. The present invention also provides a resin plate for flexographic printing obtained from the above mentioned resin composition and a process for preparing it. The present invention further provides a printing plate obtained from the resin plate and a process for preparing it.
REFERENCES:
patent: 4045231 (1977-08-01), Toda et al.
patent: 4499176 (1985-02-01), Curtis et al.
patent: 4772538 (1988-09-01), Walls et al.
patent: 4996134 (1991-02-01), Enyo et al.
Konishi Katsuji
Kusuda Hidefumi
Ueda Koichi
Hamilton Cynthia
Nippon Paint Co. Ltd.
LandOfFree
Photosensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-835143