Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Patent
1989-10-13
1992-02-11
McCamish, Marion E.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
430285, 522149, 522121, 522102, 522 42, 522 44, G03F 7004, G03F 7038
Patent
active
050875523
ABSTRACT:
The invention provides a photosensitive resin composition useful as a solder resist, etching resist or plating resist in the manufacture of printed circuit boards to exhibit excellent resistance against heat and chemicals and good adhesion to the substrate surface. The composition essentially comprises (a) a copolymeric resin of an .alpha.,.beta.-unsaturated dicarboxylic acid anhydride and an ethylenically unsaturated polymerizable compound, of which the acid anhydride units are partially esterified with an unsaturated alcohol and a saturated alcohol, and (b) a photopolymerization initiator. The composition may further comprise optional ingredients such as (c) a photopolymerizable monomeric compound, (d) an epoxy-based resin and (e) an aromatic diamine compound.
REFERENCES:
patent: 3677755 (1972-07-01), Fukui et al.
patent: 3773547 (1973-11-01), Spoor et al.
patent: 3796578 (1974-03-01), Hosoi et al.
patent: 3912670 (1975-10-01), Huemmer et al.
patent: 3974129 (1976-08-01), De La Mare
patent: 4009195 (1977-02-01), Lesster et al.
patent: 4025548 (1977-05-01), Huemmer et al.
patent: 4167415 (1979-09-01), Higuchi et al.
patent: 4183796 (1980-01-01), Ansel et al.
patent: 4370403 (1983-01-01), Takaki
patent: 4537855 (1985-08-01), Ide
patent: 4684601 (1987-08-01), Nakamura et al.
patent: 4722947 (1988-02-01), Thanawalla et al.
patent: 4745138 (1988-05-01), Thanawalla et al.
Aoyama Toshimi
Horigome Tomoki
Tazawa Kenji
McCamish Marion E.
RoDee C. D.
Tokyo Ohka Kogyo Co. Ltd.
LandOfFree
Photosensitive resin composition does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Photosensitive resin composition, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Photosensitive resin composition will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-781453