Photosensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

Reexamination Certificate

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Details

C430S278100, C430S176000, C430S192000, C430S197000, C430S907000, C430S914000, C430S964000

Reexamination Certificate

active

07108951

ABSTRACT:
The photosensitive resin composition comprising:(A) a resin containing (A1) a repeating unit having at least two groups represented by the specific general formula; and(B) a compound capable of generating an acid by the action with one of an actinic ray and a radiation.

REFERENCES:
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patent: 6203965 (2001-03-01), Cameron et al.
patent: 6468712 (2002-10-01), Fedynyshyn
patent: 6509134 (2003-01-01), Ito et al.
patent: 6756179 (2004-06-01), Fujimori et al.
patent: 2002/0081520 (2002-06-01), Soorlyakumaran et al.
patent: 2002-322217 (2002-11-01), None
patent: WO 00/17712 (2000-03-01), None
patent: WO 01/37047 (2001-05-01), None
patent: WO 03/006413 (2003-01-01), None
Kunz et al., “Experimental VUV Absorbance Study of Fluorine-Functionalized Polystyrenes”, SPIE vol. 4345 (2001) pp. 285-295.
Ito et al., “Polymer design for 157 nm chemically amplified resists” SPIE vol. 4345 (2001) pp. 273-284.
H. Ito et al., “Novel Fluoropolymers for Use in 157 nm Lithography” vol. 14 (2001) pp. 583-593.
Fender et al., “Characterization of New Aromatic Polymers for 157 nm Photoresist Applications” SPIE vol. 4345 (2001) pp. 417-427.
Crawford et al., “New Materials for 157 nm Photoresists: Characterization and Properties” SPIE vol. 3999 (Feb. 28, 2000) pp. 357-364.
Bae et al., “Fluorocarbinol Containing Acrylic (CO)Polymers With High Transparency at 157 NM” (2001) Polymer Properties, 42(2) pp. 403-404.
European Search Report dated Nov. 5, 2003.

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