Photosensitive resin composition

Details Photosensitive resin composition Photosensitive resin composition

1982-03-23

1984-07-10

Downey, Mary F.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Radiation sensitive composition or product or process of making

430916, 430919, 430920, 20415915, 20415918, 20415923, G03C 168, G03C 1727

Patent

active

044593490

ABSTRACT:
A photosensitive resin composition which comprises (1) an ethylenically unsaturated compound which can be addition polymerized to form a high molecular compound, said addition polymerizaton being initiated by a free radical and of chain-propagation, (2) a 2-polycyclic aryl-4,5-diphenylimidazolyl dimer wherein the polycyclic aryl group comprises at least two benzene rings condensed each other and (3) at least one compound selected from the group consisting of dimedone, indolacetic acid, N-naphthylglycine, S-lower alkylthioglycollic acid, 4,4'-bis[di(lower)alkylamino]benzyl, p-di(lower)alkylaminobenzoic ester, leucocrystalviolet, indoxylic acid, rhodanine, 7-di(lower)alkylaminocumarine and diarylthiourea and their derivatives, the molar ratio of the component (2) and the component (3) being from 2:1 to 1:5.

REFERENCES:
patent: 3445234 (1969-05-01), Cescon et al.
patent: 3844790 (1974-10-01), Chang et al.

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