Photosensitive resin composition

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making

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430195, 430196, 430283, 430296, 528 26, 528170, 528171, 528172, 528173, 528174, 528179, 528183, 528185, 528220, 528229, 528335, 528336, 528341, 528342, 528345, 528351, 528353, G03C 168, C08G 7310

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active

054728231

ABSTRACT:
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.

REFERENCES:
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patent: 4311785 (1982-01-01), Ahne et al.
patent: 4321319 (1982-03-01), Shoji et al.
patent: 4356247 (1982-10-01), Aotani et al.
patent: 4451551 (1984-05-01), Kataoka et al.
patent: 4565767 (1986-01-01), Kataoka et al.
patent: 4645823 (1987-02-01), Ai et al.
patent: 4656244 (1987-04-01), Ahne
patent: 4801681 (1989-01-01), Ahne

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