Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2007-11-20
2007-11-20
Neckel, Alexa D. (Department: 1753)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C524S555000, C526S310000, C526S314000, C526S332000, C526S347000
Reexamination Certificate
active
11142444
ABSTRACT:
A photosensitive polymer for forming high-resolution fine circuit patterns with an exposure light source of a short wavelength, and a chemically amplified photoresist composition including the polymer, are disclosed. The photosensitive polymer is represented by the following Formula 1,wherein R1is a hydrogen atom, R2is a hydrogen atom,R3is a chlorine atom, a bromine atom, hydroxy, cyano, t-butoxy, CH2NH2, CONH2, CH═NH, CH(OH)NH2or C(OH)═NH group, R4is a hydrogen atom or methyl group, each of 1-x-y-z, x, y and z is a degree of polymerization of each repeating unit constituting the photosensitive polymer, x, y and z are 0.01 to 0.8, respectively, and n is 1 or 2.
REFERENCES:
patent: 6743881 (2004-06-01), Kim et al.
patent: 2004/0072097 (2004-04-01), Kodama
Jegal Jin
Kim Deog-Bae
Kim Hwa-Young
Kim Jae-Hyun
Kim Sang-Jeoung
Dongjin Semichem Co., Ltd.
Eoff Anca
Neckel Alexa D.
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